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Continuous-Time Bipolar Switch Family
A1202
and A1203
5
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions
Value Units
Package Thermal Resistance
R
窲A
Package LH, 1-layer PCB with copper limited to solder pads    228  篊/W
Package LH, 2-layer PCB with 0.463 in.
2
 of copper area each
side connected by thermal vias
110  篊/W
Package UA, 1-layer PCB with copper limited to solder pads    165  篊/W
6
7
8
9
2
3
4
5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
20   40   60   80   100   120   140   160   180
T
J(max)
= 165篊; I
CC
 =  I
CC(max)
Power Derating Curve
(R
JA 
= 228 篊/W)
Package LH, 1-layer PCB
(R
JA 
= 110 篊/W)
Package LH, 2-layer PCB
(R
JA 
= 165 篊/W)
Package UA, 1-layer PCB
V
CC(min)
V
CC(max)
 
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
20  40  60  80  100  120  140  160  180
Temperature (癈)
Power Dissipation versus Ambient Temperature
(
R
J
A
 
=
 1
6
5
 
?/DIV>
C
/
W
)
P
a
c
k
a
g
e
 
U
A
,
 1
-
la
y
e
r
P
C
B
(
R
J
A
 
=
 2
2
8
 
?/DIV>
C
/
W
)
P
a
c
k
a
g
e
 L
H
,
1
-
la
y
e
r
 
P
C
B
(
R
J
A
 =
 
1
1
0
 
?/DIV>
C
/
W
)
P
a
c
k
a
g
e
 
L
H
,
 
2
-
l
a
y
e
r
 
P
C
B
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